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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LHRFVG9553/TR1
DATA SHEET
DOC. NO REV DATE :
:
QW0905-L HRFVG9553/TR1 B
: 26 - Dec. - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Page 1/8
Package Dimensions
3.5 3.2 1.95 2.6
0.70.05
3 2
4 1
0.70.05 2.8 2.2
0.70.05
0.70.05
0.6
1.95 1.05 1.5 0.9 0.9
HRF
3+ 2VG
-4 +1
Note : 1.All dimension are in millimeter tolerance is 0.2mm unless otherwise noted. 2.Specifications are subject to change without notice.
Carrier Type Dimensions
4.0 2.0 1.55 0.23
1.75
5.5 12.00.3 9.3 Polarity 4.06
4.0
3.12
2.24
Note : The tolerances unless mentioned is 0.2mm, Unit=mm.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Page 2/8
Reel Dimensions
16.01.0
1782.0
14.21.0
74.01.5
Part No. LHRFVG9553/TR1
Description 12.0mm tape,7"reel
Quantity/Reel 1500 devices
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1
Page 3/8
Absolute Maximum Ratings at Ta=25
Ratings
Parameter
Symbol
HRF VG 30 120 100 10
UNIT
Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V
IF IFP PD Ir
30 90 75
mA mA mW
A
---
Electrostatic Discharge
Operating Temperature Storage Temperature
ESD
Topr Tstg
2000
-40 ~ +85 -40 ~ +100
V
Typical Electrical & Optical Characteristics (Ta=25 )
COLOR PART NO MATERIAL Emitted AlGaInP LHRFVG9553/TR1 GaP Green Red Water Clear Lens
Pnm Dnm
Peak Dominant Spectral wave halfwidth wave length nm length
Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2 1/2 (deg) Min. Max. Min. Typ. 200 44 120 120
---565
630 ----
20 30
1.5 1.7
2.4 2.6
80 20
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Page 4/8
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 1.5 2.0 2.5 3.0
3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize@25
60 80 100
2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 100
1.1
1.0
0.9 0.8 -40 -20 -0 20 40
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity@20mA
1.0
0 -30 30
0.5
-60
60
0 550 600 650 700
100% 75% 50%
25%
0
25% 50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Page 5/8
Typical Electro-Optical Characteristics Curve
VG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0
10 1.0
0.1 2.0 3.0 4.0 5.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9 0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity@20mA
1.0
0 -30
0.5
30
-60
60
0.0 500 550 600 650
100% 75% 50%
25%
0
25% 50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Recommended Soldering Conditions 1. Hand Solder
Basic spec is 280 3 sec one time only.
Page 6/8
2. Wave Solder
Soldering heat Max. 260 2455 within 5 sec 120 ~ 150 Preheat
120 ~ 180 sec
3. LEAD Reflow Solder
Temp. () 240
Rising +5/sec Cooling -5/sec
150 120
Preheat
60 ~ 120 sec
5sec
Time
4. PB-Free Reflow Solder
1~5 C/sec 260 C MaX. 10sec.Max
Preheat 180~200 C 1~5 C/sec
Above 220 C 60 sec.Max.
120 sec.Max.
Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Precautions For Use: Storage time:
1.The operation of Temperatures and RH are : 5 ~35,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ~ 35,RH<60%, they should be treated at 605 fo r 15hrs.
Page 7/8
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFVG9553/TR1 Reliability Test: Page 8/8
Classification
Test Item
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Reference Standard
MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test Endurance Test Low Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008 JIS C 7021: B-10
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature High Humidity Storage Test
1.IR-Reflow In-Board, 2 Times 2.Ta=65 5 3.RH=90 %~95 % 4.t=1000hrs 2hrs 1.IR-Reflow In-Board,2 times 2.Ta=105 5& -40 5 (10min) (10min) 3.total 10 cycles 1.T.Sol=260 5 2.Dwell Time= 10 1sec. 1.T.Sol=235 5 2.Immersion time 2 0.5sec 3.Immersion rate 25 2.5mm/sec 4.Immersion rate 25 2.5mm/sec 5.Coverage 95% of the dipped surface 1.105 ~ 25 ~ 55 ~ 25 30mins 5mins 30mins 5mins 2.10 Cyeles
MIL-STD-202F:103B JIS C 7021: B-11
Thermal Shock Test
MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011
Solder Resistance Test
MIL-STD-202F: 210A MIL-STD-750D: 2031 JIS C 7021: A-1 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4
Solderability Test Environmental Test Temperature Cycling
Solderability Test
Ramp-up rate(183 to Peak) +3 second max Temp. maintain at 125( 25) 120 seconds max Temp. maintain above 183 60-150 seconds Peak temperature range 235 +5-0 Time within 5 of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 /second max
MIL-STD-750D:2031.2 J-STD-020

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